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Nullam dignissim, ante scelerisque the is euismod fermentum odio sem semper the is erat, a feugiat leo urna eget eros. Duis Aenean a imperdiet risus.
Micro-end mills with diameters of 0.1–0.5 mm are prone to breakage and rapid wear when machining IC substrates, precision circuit boards, and fine isolation grooves. Conventional coatings exhibit poor adhesion and uneven coverage on small-diameter cutting edges, resulting in insufficient machining accuracy for precision grooves and failure to meet the tight tolerance requirements of high-end PCBs and chip substrates.
Utilizing nanocrystalline CVD diamond coating technology to precisely control coating thickness, ensuring sharp cutting edges for micro-diameter tools; optimizing deposition parameters to achieve uniform, full-angle coverage of the cutting edge, thereby enhancing coating adhesion and chipping resistance; specifically tailoring low-friction, high-wear-resistance coating properties for ultra-fine trace and micro-groove machining, compatible with high-precision, minimal-stock-removal cutting.
The micro-end-mill tools demonstrate significantly enhanced breakage resistance and wear resistance, with a 80% reduction in tool breakage rate; machining accuracy remains consistently within specification, with burr-free and deformation-free edges on micro-grooves and circuit traces; tool life is extended by over 20 times, perfectly meeting the precision machining requirements for 5G communications, chip packaging, and high-end PCBs, and successfully passing customers’ mass-production validation.
